CHIOZZI, DIEGO
 Distribuzione geografica
Continente #
NA - Nord America 319
EU - Europa 220
AS - Asia 166
SA - Sud America 5
Totale 710
Nazione #
US - Stati Uniti d'America 316
CN - Cina 93
IT - Italia 71
IE - Irlanda 56
SG - Singapore 41
SE - Svezia 39
TR - Turchia 26
DE - Germania 19
FI - Finlandia 10
BE - Belgio 9
BR - Brasile 5
AT - Austria 4
CZ - Repubblica Ceca 4
CA - Canada 3
GB - Regno Unito 3
SA - Arabia Saudita 3
IN - India 2
FR - Francia 1
JP - Giappone 1
NL - Olanda 1
PL - Polonia 1
SK - Slovacchia (Repubblica Slovacca) 1
UA - Ucraina 1
Totale 710
Città #
Chandler 58
Dublin 56
Ann Arbor 44
Santa Clara 39
Singapore 35
Parma 28
Izmir 26
New York 18
Shanghai 17
Beijing 16
Boardman 15
Dearborn 14
Nanjing 14
Ashburn 13
Bremen 9
Brussels 9
Princeton 9
Wilmington 9
Shenyang 6
Chiari 5
Los Angeles 5
Guangzhou 4
Neubiberg 4
San Mateo 4
Al Qaţīf 3
Genova 3
Houston 3
Jinan 3
Klagenfurt 3
Kunming 3
Milan 3
Nanchang 3
Calcinate 2
Catania 2
Frankfurt am Main 2
Fremont 2
Hebei 2
Jamshedpur 2
Montreal 2
Phoenix 2
Redwood City 2
Seattle 2
Tianjin 2
Verona 2
Zhengzhou 2
Anshan 1
Bad Soden 1
Baotou 1
Borgosatollo 1
Borås 1
Bratislava 1
Brno 1
Carpenedolo 1
Changsha 1
Cordovado 1
Falkenstein 1
Falls Church 1
Haikou 1
Helsinki 1
Miami 1
Montirone 1
Nanyang 1
Norwalk 1
Nürnberg 1
Polska 1
Shaoxing 1
Tappahannock 1
Totale 529
Nome #
Cold plates easy design software tool for industrial electronic applications 100
Development aspects of a modular integrated 1200V-35A SiC MOSFET bi-directional switch 97
A Neural Network based Approach to Simulate Electro-thermal Device Interaction in SPICE Environment 97
Non-linear thermal simulation at system level: Compact modelling and experimental validation 88
Efficient thermal modeling – Compact boundary conditions for electro-thermal problems 88
Numerical analysis and experimental tests for solder joints power cycling optimization 77
Water cold plates for high power converters: A software tool for easy optimized design 75
A simple 1-D finite elements approach to model the effect of PCB in electronic assemblies 60
Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch 60
Totale 742
Categoria #
all - tutte 2.567
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 2.567


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/202064 0 0 0 0 0 16 10 4 6 18 9 1
2020/202131 2 1 1 4 0 3 2 2 13 2 1 0
2021/202251 3 2 1 6 3 3 2 2 3 5 5 16
2022/2023215 15 24 17 13 30 22 0 6 73 1 14 0
2023/202484 5 9 3 2 4 28 4 1 3 5 2 18
2024/2025113 11 14 15 25 21 27 0 0 0 0 0 0
Totale 742