CHIOZZI, DIEGO
 Distribuzione geografica
Continente #
NA - Nord America 342
EU - Europa 240
AS - Asia 212
SA - Sud America 23
OC - Oceania 1
Totale 818
Nazione #
US - Stati Uniti d'America 339
CN - Cina 100
IT - Italia 71
SG - Singapore 57
IE - Irlanda 56
SE - Svezia 40
TR - Turchia 26
BR - Brasile 23
DE - Germania 20
HK - Hong Kong 17
FI - Finlandia 11
BE - Belgio 10
NL - Olanda 9
RU - Federazione Russa 7
AT - Austria 4
CZ - Repubblica Ceca 4
GB - Regno Unito 4
ID - Indonesia 4
CA - Canada 3
SA - Arabia Saudita 3
IN - India 2
AU - Australia 1
FR - Francia 1
JP - Giappone 1
LK - Sri Lanka 1
PL - Polonia 1
SK - Slovacchia (Repubblica Slovacca) 1
UA - Ucraina 1
UZ - Uzbekistan 1
Totale 818
Città #
Chandler 58
Dublin 56
Ann Arbor 44
Santa Clara 39
Singapore 38
Parma 28
Izmir 26
New York 19
Shanghai 18
Beijing 17
Hong Kong 17
Ashburn 15
Boardman 15
Dearborn 14
Nanjing 14
Brussels 10
Council Bluffs 10
Bremen 9
Princeton 9
Wilmington 9
Los Angeles 7
Moscow 7
Shenyang 6
Chiari 5
Guangzhou 4
Jakarta 4
Neubiberg 4
San Mateo 4
Al Qaţīf 3
Genova 3
Houston 3
Jinan 3
Klagenfurt 3
Kunming 3
Milan 3
Nanchang 3
The Dalles 3
Zhengzhou 3
Calcinate 2
Catania 2
Frankfurt am Main 2
Fremont 2
Hebei 2
Jamshedpur 2
Montreal 2
Phoenix 2
Redwood City 2
Seattle 2
Tianjin 2
Verona 2
Anshan 1
Bad Soden 1
Bagé 1
Bandeira do Sul 1
Baotou 1
Belo Horizonte 1
Borgosatollo 1
Borås 1
Bratislava 1
Brno 1
Cajati 1
Cametá 1
Campo Grande 1
Campo Novo do Parecis 1
Carpenedolo 1
Changsha 1
Chicago 1
Colombo 1
Cordovado 1
Curuçá 1
Dallas 1
Falkenstein 1
Falls Church 1
Foshan 1
Guarulhos 1
Haikou 1
Helsinki 1
Itambaracá 1
London 1
Manhuaçu 1
Meizhou 1
Miami 1
Montirone 1
Munich 1
Nanyang 1
Norwalk 1
Nürnberg 1
Polska 1
Porto Alegre 1
Poços de Caldas 1
Presidente Prudente 1
Rio de Janeiro 1
Shaoxing 1
Stockholm 1
São Paulo 1
Tappahannock 1
Tashkent 1
Tianguá 1
Turku 1
Volta Redonda 1
Totale 610
Nome #
A Neural Network based Approach to Simulate Electro-thermal Device Interaction in SPICE Environment 116
Cold plates easy design software tool for industrial electronic applications 112
Development aspects of a modular integrated 1200V-35A SiC MOSFET bi-directional switch 105
Non-linear thermal simulation at system level: Compact modelling and experimental validation 99
Water cold plates for high power converters: A software tool for easy optimized design 95
Efficient thermal modeling – Compact boundary conditions for electro-thermal problems 94
Numerical analysis and experimental tests for solder joints power cycling optimization 88
A simple 1-D finite elements approach to model the effect of PCB in electronic assemblies 74
Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch 67
Totale 850
Categoria #
all - tutte 3.075
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 3.075


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/20201 0 0 0 0 0 0 0 0 0 0 0 1
2020/202131 2 1 1 4 0 3 2 2 13 2 1 0
2021/202251 3 2 1 6 3 3 2 2 3 5 5 16
2022/2023215 15 24 17 13 30 22 0 6 73 1 14 0
2023/202484 5 9 3 2 4 28 4 1 3 5 2 18
2024/2025221 11 14 15 25 21 36 9 12 24 14 11 29
Totale 850