Power cycling is the most realistic stress test for thermo-mechanical accelerated failure mechanisms in power devices. The fast evolution in solder materials and packaging techniques makes it necessary to find the proper accelerate test conditions for any specific package/mounting solution. This paper deals with a procedure for determining the power cycling optimal parameters (power rating, period, duty-cycle, cooling conditions) for accelerated stress tests on solder joints of SMD power devices mounted on a specific board. The procedure is based on FEM numerical analysis and preliminary experimental tests. Simulation results are presented; they are validated by comparison with measurements performed using an ad-hoc experimental setup. Early power cycling is also shown.

Numerical analysis and experimental tests for solder joints power cycling optimization / Cova, Paolo; Delmonte, Nicola; Chiozzi, Diego. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 55:9-10(2015), pp. 2036-2040. [10.1016/j.microrel.2015.06.020]

Numerical analysis and experimental tests for solder joints power cycling optimization

COVA, Paolo;DELMONTE, Nicola;CHIOZZI, DIEGO
2015-01-01

Abstract

Power cycling is the most realistic stress test for thermo-mechanical accelerated failure mechanisms in power devices. The fast evolution in solder materials and packaging techniques makes it necessary to find the proper accelerate test conditions for any specific package/mounting solution. This paper deals with a procedure for determining the power cycling optimal parameters (power rating, period, duty-cycle, cooling conditions) for accelerated stress tests on solder joints of SMD power devices mounted on a specific board. The procedure is based on FEM numerical analysis and preliminary experimental tests. Simulation results are presented; they are validated by comparison with measurements performed using an ad-hoc experimental setup. Early power cycling is also shown.
Numerical analysis and experimental tests for solder joints power cycling optimization / Cova, Paolo; Delmonte, Nicola; Chiozzi, Diego. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 55:9-10(2015), pp. 2036-2040. [10.1016/j.microrel.2015.06.020]
File in questo prodotto:
Non ci sono file associati a questo prodotto.

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11381/2796627
Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus 3
  • ???jsp.display-item.citation.isi??? 3
social impact