The use of FEA (Finite Element Analysis) in power devices thermal study has become a well-established procedure. Simulation through FEM (Finite Element Method) permits to shorten design time of such devices. However, electro-thermal simulation for long pulses (i.e., t > 10 ms) are strongly dependent on parts connected to the device (e.g., board), and it is necessary to model in an efficient way these external components. Here, a simple and effective approach to accomplish this task is proposed.
Efficient thermal modeling – Compact boundary conditions for electro-thermal problems / Chiozzi, Diego; Bernardoni, M.; Cova, Paolo; Delmonte, Nicola. - STAMPA. - (2015), pp. 36-36. (Intervento presentato al convegno Infineon Spring InnoDays’15 - PhD Network Workshop tenutosi a Villach (Austria) nel 5 - 7 marzo 2015).
Efficient thermal modeling – Compact boundary conditions for electro-thermal problems
CHIOZZI, DIEGO;COVA, Paolo;DELMONTE, Nicola
2015-01-01
Abstract
The use of FEA (Finite Element Analysis) in power devices thermal study has become a well-established procedure. Simulation through FEM (Finite Element Method) permits to shorten design time of such devices. However, electro-thermal simulation for long pulses (i.e., t > 10 ms) are strongly dependent on parts connected to the device (e.g., board), and it is necessary to model in an efficient way these external components. Here, a simple and effective approach to accomplish this task is proposed.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
