In this paper, a simple method to describe the effect of Printed Circuit Board (PCB) and environment on the thermal behavior of packaged devices is addressed. This approach aims at exploiting the benefit of compact thermal models, which are necessarily one-dimensional, together with the advantage of Finite Element (FE) modeling, which retains all the three-dimensional geometrical details, only in the regions of the model that must be accurately described. The main focus is on correct modeling of long power pulses for subsequent electro-thermal and thermo-mechanical analysis at chip level.

A simple 1-D finite elements approach to model the effect of PCB in electronic assemblies / Chiozzi, Diego; Bernardoni, M.; Delmonte, Nicola; Cova, Paolo. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 58:(2016), pp. 126-132. [10.1016/j.microrel.2015.11.029]

A simple 1-D finite elements approach to model the effect of PCB in electronic assemblies

CHIOZZI, DIEGO;DELMONTE, Nicola;COVA, Paolo
2016-01-01

Abstract

In this paper, a simple method to describe the effect of Printed Circuit Board (PCB) and environment on the thermal behavior of packaged devices is addressed. This approach aims at exploiting the benefit of compact thermal models, which are necessarily one-dimensional, together with the advantage of Finite Element (FE) modeling, which retains all the three-dimensional geometrical details, only in the regions of the model that must be accurately described. The main focus is on correct modeling of long power pulses for subsequent electro-thermal and thermo-mechanical analysis at chip level.
A simple 1-D finite elements approach to model the effect of PCB in electronic assemblies / Chiozzi, Diego; Bernardoni, M.; Delmonte, Nicola; Cova, Paolo. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 58:(2016), pp. 126-132. [10.1016/j.microrel.2015.11.029]
File in questo prodotto:
File Dimensione Formato  
MR 1-D 20106 Post-print.pdf

accesso aperto

Tipologia: Documento in Post-print
Licenza: Creative commons
Dimensione 1.08 MB
Formato Adobe PDF
1.08 MB Adobe PDF Visualizza/Apri

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11381/2807559
Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus 20
  • ???jsp.display-item.citation.isi??? 19
social impact