The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 Vâ35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters. An accurate electro-thermal fluid dynamic model is set up and validated by thermal characterization on a prototype; numerical models have been used to study the internal temperature distribution and to propose further optimization.
Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch / Cova, Paolo; Aliyu, A. M.; Castellazzi, A.; Chiozzi, Diego; Delmonte, Nicola; Lasserre, P.; Pignoloni, N.. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 76-77:(2017), pp. 277-281. [10.1016/j.microrel.2017.06.062]
Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch
COVA, Paolo;CHIOZZI, DIEGO;DELMONTE, Nicola;
2017-01-01
Abstract
The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 Vâ35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters. An accurate electro-thermal fluid dynamic model is set up and validated by thermal characterization on a prototype; numerical models have been used to study the internal temperature distribution and to propose further optimization.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
