This works describes the use of electro-thermal numerical simulations for the design, modeling, and reliability evaluation of semiconductor devices and electronic circuits. Examples at the device level focus on 2D and 3D simulations of GaAs-based HFETs and HBTs, while a case study of hybrid highpower DC/DC converters is shown to illustrate the possibilities and challenges of thermal simulation at board level.
Electro-thermal simulation of semiconductor devices and hybrid circuits / Menozzi, Roberto; DE IACO, E; Sozzi, Giovanna; Cova, Paolo; Delmonte, Nicola; Zampardi, P; Kwok, K; Cismaru, C; Metzger, A.. - (2006), pp. WI-4-1-WI-4-6. (Intervento presentato al convegno IEEE International Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD’06 tenutosi a Perth (Western Australia) nel 6-8 dicembre) [10.1109/COMMAD.2006.4429863].
Electro-thermal simulation of semiconductor devices and hybrid circuits
MENOZZI, Roberto;SOZZI, Giovanna;COVA, Paolo;DELMONTE, Nicola;
2006-01-01
Abstract
This works describes the use of electro-thermal numerical simulations for the design, modeling, and reliability evaluation of semiconductor devices and electronic circuits. Examples at the device level focus on 2D and 3D simulations of GaAs-based HFETs and HBTs, while a case study of hybrid highpower DC/DC converters is shown to illustrate the possibilities and challenges of thermal simulation at board level.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
