FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules

In this work, we present novel 3D-printable plastic direct coolers for power modules. The main objective of the work is to identify highly efficient solutions for heat extraction in terms of thermal resistance and temperature uniformity, to reduce the thermomechanical stresses that can lead to power module failures as much as possible. The study relies on finite element modeling to guide the design toward optimal solutions. An ad hoc test bench was built to test the effectiveness of prototypes.