This work focuses on innovative coolers for power semiconductor modules. The jet-impingement technique is used for direct device cooling with custom 3D-printed cooler structures. The paper presents a solution for power modules with dissipated power density up to 20 W/cm 2 . The coolers were designed using the Finite Element Method (FEM), which allows to evaluate both the thermal and hydraulic performance, and to identifying the optimal geometry. Experimental results of a 3D printed prototype are also presented, showing god agreement with the FEM simulations.
Analysis of Innovative 3D-Printed Direct Coolers for Modular Power Devices / Delmonte, Nicola; Cova, Paolo; Spaggiari, Davide; Santoro, Danilo; Sciancalepore, Corrado; Menozzi, Roberto. - ELETTRONICO. - (2023). (Intervento presentato al convegno 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) tenutosi a Budapest (Ungheria) nel 27-29 settembre 2023) [10.1109/THERMINIC60375.2023.10325915].
Analysis of Innovative 3D-Printed Direct Coolers for Modular Power Devices
Delmonte, Nicola;Cova, Paolo;Spaggiari, Davide;Santoro, Danilo;Sciancalepore, Corrado;Menozzi, Roberto
2023-01-01
Abstract
This work focuses on innovative coolers for power semiconductor modules. The jet-impingement technique is used for direct device cooling with custom 3D-printed cooler structures. The paper presents a solution for power modules with dissipated power density up to 20 W/cm 2 . The coolers were designed using the Finite Element Method (FEM), which allows to evaluate both the thermal and hydraulic performance, and to identifying the optimal geometry. Experimental results of a 3D printed prototype are also presented, showing god agreement with the FEM simulations.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
