High-throughput and cost-effective method for production of high-quality semi-insulating InP substrates

A novel technique for preparation of high-resistivity indium phosphide (InP) via post-growth treatment of undoped n-type wafers is presented. The method includes the deposition of a controlled quantity of iron on both faces of as-cut wafers by a simple chemical bath, and the subsequent Fe diffusion by thermal annealing. The reproducible low - to - high resistivity conversion is explained considering two simultaneous phenomena: the annealing-controlled in-diffusion of Fe deep acceptors and the out-diffusion of hydrogen-related shallow donors. Differently from standard Fe-doped melt-grown InP single crystals, this process does not suffer from segregation, thus the Fe-concentration is constant from wafer to wafer, with no striations and radial gradients deriving from the convex solid-liquid interface during growth. Main advantages of the developed process are: i) an entire undoped InP boule may be sliced and converted to semi-insulating, which makes the process cost-effective; ii) reproducible and uniform semi-insulating properties from batch to batch of wafers; iii) the Fe incorporation is precisely controlled, and minimized, so that electrical characteristics of Fe-diffused wafers are superior to those of traditional semi-insulating melt-grown InP crystals doped via addition of elemental Fe to the melt.