We have developed and experimentally validated a 3D model for thermal analysis and reliability-conscious design of hybrid power converters, using the commercial finite-element solver COMSOLTM. The model was tuned using an accurate packaged MOSFET model and a specially-designed test board for multi-point temperature measurements. Measured and modeled temperatures showed good agreement for various dissipated power levels. A simplified version of the packaged MOSFET was then used in a bridge configuration to build a thermal model of the converter. After thermal studies, we performed preliminary finite-element analysis of the thermally-induced stress distributions.
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.