This study investigates a jet-impingement cooling system using an actively heated steel plate to emulate electronic device behavior. Infrared thermography and filtering techniques are employed to estimate local convective heat transfer. Results are validated through numerical simulations under varying flow conditions.

Thermal Characterization of a Novel Direct Cooler Design for Modular Power Devices / Gerbino, Filippo; Cattani, Luca; Bozzoli, Fabio; Spaggiari, Davide; Cova, Paolo; Menozzi, Roberto. - ELETTRONICO. - (2025), pp. 1-4. [10.1109/therminic65879.2025.11216885]

Thermal Characterization of a Novel Direct Cooler Design for Modular Power Devices

Gerbino, Filippo;Cattani, Luca;Bozzoli, Fabio;Spaggiari, Davide;Cova, Paolo;Menozzi, Roberto
2025-01-01

Abstract

This study investigates a jet-impingement cooling system using an actively heated steel plate to emulate electronic device behavior. Infrared thermography and filtering techniques are employed to estimate local convective heat transfer. Results are validated through numerical simulations under varying flow conditions.
2025
979-8-3315-9486-2
Thermal Characterization of a Novel Direct Cooler Design for Modular Power Devices / Gerbino, Filippo; Cattani, Luca; Bozzoli, Fabio; Spaggiari, Davide; Cova, Paolo; Menozzi, Roberto. - ELETTRONICO. - (2025), pp. 1-4. [10.1109/therminic65879.2025.11216885]
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11381/3039534
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