In this work, a Finite Element (FE) thermal model is presented to further understand the mechanism of surge current-induced failure of press-pack devices. The model is set up with the results of electrical measurements and high-framerate video acquisition taken during diode tests to identify the surge current at which the failure occurs. The tests were carried out with an ad hoc bench specifically designed to have surge currents with different energies to be dissipated in the diode under test using the Integral Resonant Sliding Mode Control (IRSMC) technique.
Evaluation with FEM analysis of peak case non-rupture current for power devices working at very high current / Spaggiari, D.; Cova, P.; Portesine, F.; Aschero, M.; Delmonte, N.. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 171:(2025). [10.1016/j.microrel.2025.115787]
Evaluation with FEM analysis of peak case non-rupture current for power devices working at very high current
Spaggiari, D.;Cova, P.;Delmonte, N.
2025-01-01
Abstract
In this work, a Finite Element (FE) thermal model is presented to further understand the mechanism of surge current-induced failure of press-pack devices. The model is set up with the results of electrical measurements and high-framerate video acquisition taken during diode tests to identify the surge current at which the failure occurs. The tests were carried out with an ad hoc bench specifically designed to have surge currents with different energies to be dissipated in the diode under test using the Integral Resonant Sliding Mode Control (IRSMC) technique.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
