This paper presents an experimental study of the main causes of scrap during the production of a woofer loudspeaker. After analyzing the most critical components of a transducer, samples with reference and modified components have been built and characterized in terms of frequency-response and linear distortion curves, and electrical, mechanical, acoustical parameters. In addition, a second set of samples has been built using reference components but varying the assembly process parameters; these samples also have been characterized as the previous ones. Measurements have been performed both in an anechoic chamber, along a production line and inside a car. By the analysis of acquired data, the authors have individuated the most influential components and assembly parameters in terms of required performance.

Woofer performance variance due to components and assembly process / Bellini, Maria Costanza; Farina, Angelo. - ELETTRONICO. - (2018). ((Intervento presentato al convegno 144th AES Convention tenutosi a Milano nel 2018 May 23–26.

Woofer performance variance due to components and assembly process

Maria Costanza Bellini
;
Angelo Farina
2018

Abstract

This paper presents an experimental study of the main causes of scrap during the production of a woofer loudspeaker. After analyzing the most critical components of a transducer, samples with reference and modified components have been built and characterized in terms of frequency-response and linear distortion curves, and electrical, mechanical, acoustical parameters. In addition, a second set of samples has been built using reference components but varying the assembly process parameters; these samples also have been characterized as the previous ones. Measurements have been performed both in an anechoic chamber, along a production line and inside a car. By the analysis of acquired data, the authors have individuated the most influential components and assembly parameters in terms of required performance.
978-1-942220-24-4
Woofer performance variance due to components and assembly process / Bellini, Maria Costanza; Farina, Angelo. - ELETTRONICO. - (2018). ((Intervento presentato al convegno 144th AES Convention tenutosi a Milano nel 2018 May 23–26.
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11381/2847873
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