This paper presents the work on an alternative integration scheme for a half-bridge switch using 70 μm thin Si IGBTs and diodes addressing higher strength, higher toughness and higher thermal conductivity. The switch is totally bond wireless, since bonded wires increase self-heating and introduce further thermomechanical degradation mechanisms. Moreover, this solution is equipped with double side liquid cooling, and plug-in edge connectors both on the driver and load sides, allowing high power density, good accessibility and modularity. Preliminary experimental results show good switching behavior.
Modular plug-in high-performance assembly of a power converter / Solomon, A. K.; Castellazzi, A.; Delmonte, Nicola; Cova, Paolo. - CD-ROM. - (2016), pp. 1-10. (Intervento presentato al convegno IEEE 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe), 2016 tenutosi a Karlsruhe (Germany) nel 5-9 September 2016) [10.1109/EPE.2016.7695652].
Modular plug-in high-performance assembly of a power converter
DELMONTE, Nicola;COVA, Paolo
2016-01-01
Abstract
This paper presents the work on an alternative integration scheme for a half-bridge switch using 70 μm thin Si IGBTs and diodes addressing higher strength, higher toughness and higher thermal conductivity. The switch is totally bond wireless, since bonded wires increase self-heating and introduce further thermomechanical degradation mechanisms. Moreover, this solution is equipped with double side liquid cooling, and plug-in edge connectors both on the driver and load sides, allowing high power density, good accessibility and modularity. Preliminary experimental results show good switching behavior.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
