This work presents the development of a highly integrated power switch, based on 70μm thin IGBTs and diodes rated at 600 V. The integration relies on advanced ceramic substrate technology, featuring double-etched patterned copper tracks for a fully bond-wire-less double-sided cooling packaging solution; viases are also used in the ceramic substrates for vertical current conduction, which enables the introduction of a ground-plane structure within the switch, with greatly reduced overall values of parasitic inductance. The paper also proposes an outline of system-level integration solutions for ensuring that low-inductance characteristics at switch level are not lost when interconnecting to input filter and load.

Modular power converter integration based on non-conventional power switch assembly and interconnects / Solomon, A. K.; Castellazzi, A.; Delmonte, N.; Cova, P.. - ELETTRONICO. - (2015), pp. 837-843. ((Intervento presentato al convegno 9th International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia) tenutosi a Seoul nel 1-5 June 2015 [10.1109/ICPE.2015.7167879].

Modular power converter integration based on non-conventional power switch assembly and interconnects

DELMONTE, Nicola;COVA, Paolo
2015

Abstract

This work presents the development of a highly integrated power switch, based on 70μm thin IGBTs and diodes rated at 600 V. The integration relies on advanced ceramic substrate technology, featuring double-etched patterned copper tracks for a fully bond-wire-less double-sided cooling packaging solution; viases are also used in the ceramic substrates for vertical current conduction, which enables the introduction of a ground-plane structure within the switch, with greatly reduced overall values of parasitic inductance. The paper also proposes an outline of system-level integration solutions for ensuring that low-inductance characteristics at switch level are not lost when interconnecting to input filter and load.
978-8-9570-8254-6
978-8-9570-8254-6
Modular power converter integration based on non-conventional power switch assembly and interconnects / Solomon, A. K.; Castellazzi, A.; Delmonte, N.; Cova, P.. - ELETTRONICO. - (2015), pp. 837-843. ((Intervento presentato al convegno 9th International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia) tenutosi a Seoul nel 1-5 June 2015 [10.1109/ICPE.2015.7167879].
File in questo prodotto:
Non ci sono file associati a questo prodotto.

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11381/2795388
Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus 6
  • ???jsp.display-item.citation.isi??? 6
social impact