In this work, the development of a physics based reliability prediction model for thermo-mechanical fatigue of chip solder joints in power converters is illustrated. By this model, the thermo-mechanical stress-strain distribution in the structure is studied by means of Finite Element (FE) method using COMSOL Multiphysics, and the operational life of the solder joints is calculated according to the Coffin-Manson law. As a case study, the estimation of the fatigue life of solder joints in SO8-packaged power MOSFETs is investigated. A stress bench is under design to tune the developed FE model by experimental results.
Evaluation of low-cycle-fatigue life of solder joints in surface mounting power devices by finite element modeling / Delmonte, Nicola; F., Giuliani; Bernardoni, Mirko; Cova, Paolo. - (2012). (Intervento presentato al convegno COMSOL Conference EUROPE 2012 tenutosi a Milano (Italy) nel 10 - 12 ottobre 2012).
Evaluation of low-cycle-fatigue life of solder joints in surface mounting power devices by finite element modeling
DELMONTE, Nicola;BERNARDONI, Mirko;COVA, Paolo
2012-01-01
Abstract
In this work, the development of a physics based reliability prediction model for thermo-mechanical fatigue of chip solder joints in power converters is illustrated. By this model, the thermo-mechanical stress-strain distribution in the structure is studied by means of Finite Element (FE) method using COMSOL Multiphysics, and the operational life of the solder joints is calculated according to the Coffin-Manson law. As a case study, the estimation of the fatigue life of solder joints in SO8-packaged power MOSFETs is investigated. A stress bench is under design to tune the developed FE model by experimental results.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
