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EnglishThe reliability of press-packed IGBTs strongly depends on the solutions adopted in terms of heat dissipation and thermo-mechanical stress management so as to guarantee satisfactory electrical and thermal contact conditions throughout the service life. In this paper, two aspects concerning the design process of a single-chip press-pack IGBT are outlined: i) cyclic stresses and strains occurring in the package and in the chip are discussed on the basis of finite element (FE) simulations, ii) a testing rig developed for accelerated testing of single IGBT chips under controlled contact pressure conditions is presented.
| Titolo: | FE-Modeling and Physical Testing of IGBTs for Press-Packaging |
| Autori: | |
| Data di pubblicazione: | 1999 |
| Rivista: | |
| Abstract: | The reliability of press-packed IGBTs strongly depends on the solutions adopted in terms of heat dissipation and thermo-mechanical stress management so as to guarantee satisfactory electrical and thermal contact conditions throughout the service life. In this paper, two aspects concerning the design process of a single-chip press-pack IGBT are outlined: i) cyclic stresses and strains occurring in the package and in the chip are discussed on the basis of finite element (FE) simulations, ii) a testing rig developed for accelerated testing of single IGBT chips under controlled contact pressure conditions is presented. |
| Handle: | http://hdl.handle.net/11381/2441594 |
| Appare nelle tipologie: | 4.1a Atto convegno Rivista |
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http://hdl.handle.net/11381/2441594
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