The reliability of press-packed IGBTs strongly depends on the solutions adopted in terms of heat dissipation and thermo-mechanical stress management so as to guarantee satisfactory electrical and thermal contact conditions throughout the service life. In this paper, two aspects concerning the design process of a single-chip press-pack IGBT are outlined: i) cyclic stresses and strains occurring in the package and in the chip are discussed on the basis of finite element (FE) simulations, ii) a testing rig developed for accelerated testing of single IGBT chips under controlled contact pressure conditions is presented.
FE-Modeling and Physical Testing of IGBTs for Press-Packaging / Pirondi, Alessandro; Nicoletto, Gianni; Cova, Paolo; M., Pasqualetti; M., Portesine; P. E., Zani; A., Camera. - In: MATERIALS RESEARCH SOCIETY SYMPOSIA PROCEEDINGS. - ISSN 0272-9172. - 535:(1999), pp. 171-176. (Intervento presentato al convegno 1998 MRS Fall Meeting tenutosi a Boston (USA) nel 30 Nov.-3 Dic. 1998) [10.1557/PROC-535-171].
FE-Modeling and Physical Testing of IGBTs for Press-Packaging
PIRONDI, Alessandro;NICOLETTO, Gianni;COVA, Paolo;
1999-01-01
Abstract
The reliability of press-packed IGBTs strongly depends on the solutions adopted in terms of heat dissipation and thermo-mechanical stress management so as to guarantee satisfactory electrical and thermal contact conditions throughout the service life. In this paper, two aspects concerning the design process of a single-chip press-pack IGBT are outlined: i) cyclic stresses and strains occurring in the package and in the chip are discussed on the basis of finite element (FE) simulations, ii) a testing rig developed for accelerated testing of single IGBT chips under controlled contact pressure conditions is presented.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
