CINECA IRIS Institutional Research Information System
IRIS è la soluzione IT che facilita la raccolta e la gestione dei dati relativi alle attività e ai prodotti della ricerca. Fornisce a ricercatori, amministratori e valutatori gli strumenti per monitorare i risultati della ricerca, aumentarne la visibilità e allocare in modo efficace le risorse disponibili.
EnglishThe reliability of press-packed IGBTs strongly depends on the solutions adopted in terms of heat dissipation and thermo-mechanical stress management so as to guarantee satisfactory electrical and thermal contact conditions throughout the service life. In this paper, two aspects concerning the design process of a single-chip press-pack IGBT are outlined: i) cyclic stresses and strains occurring in the package and in the chip are discussed on the basis of finite element (FE) simulations, ii) a testing rig developed for accelerated testing of single IGBT chips under controlled contact pressure conditions is presented.
FE-Modeling and Physical Testing of IGBTs for Press-Packaging / A. Pirondi; G. Nicoletto; P. Cova; M. Pasqualetti; M. Portesine; P. E. Zani; A. Camera. - In: MATERIALS RESEARCH SOCIETY SYMPOSIA PROCEEDINGS. - ISSN 0272-9172. - 535(1999), pp. 171-176. ((Intervento presentato al convegno 1998 MRS Fall Meeting tenutosi a Boston (USA) nel 30 Nov.-3 Dic. 1998 [10.1557/PROC-535-171].
| Titolo: | FE-Modeling and Physical Testing of IGBTs for Press-Packaging | |
| Autori: | ||
| Data di pubblicazione: | 1999 | |
| Rivista: | ||
| Citazione: | FE-Modeling and Physical Testing of IGBTs for Press-Packaging / A. Pirondi; G. Nicoletto; P. Cova; M. Pasqualetti; M. Portesine; P. E. Zani; A. Camera. - In: MATERIALS RESEARCH SOCIETY SYMPOSIA PROCEEDINGS. - ISSN 0272-9172. - 535(1999), pp. 171-176. ((Intervento presentato al convegno 1998 MRS Fall Meeting tenutosi a Boston (USA) nel 30 Nov.-3 Dic. 1998 [10.1557/PROC-535-171]. | |
| Abstract: | The reliability of press-packed IGBTs strongly depends on the solutions adopted in terms of heat dissipation and thermo-mechanical stress management so as to guarantee satisfactory electrical and thermal contact conditions throughout the service life. In this paper, two aspects concerning the design process of a single-chip press-pack IGBT are outlined: i) cyclic stresses and strains occurring in the package and in the chip are discussed on the basis of finite element (FE) simulations, ii) a testing rig developed for accelerated testing of single IGBT chips under controlled contact pressure conditions is presented. | |
| Handle: | http://hdl.handle.net/11381/2441594 | |
| Appare nelle tipologie: | 4.1a Atto convegno Rivista |
File in questo prodotto:
http://hdl.handle.net/11381/2441594
Copyright © 2021