Product development in the power electronic industry is characterized by short time-to-market and high reliability. Improved design methods and advanced modeling techniques are therefore required to support package design selection and to arrive at lifetime prediction algorithms for failure prevention. In this work experimental and computational activities aimed at supporting the development of a high-power press-pack IGBT are reported. A rig for accelerated testing of single IGBT chips under controlled contact pressure conditions is presented. Then, thermo-mechanical simulations of accelerated tests by the finite element method provided stress/strain evolution in the device and insight into the sources of local degradation.
Integrated approach for reliability assessment of press-pack IGBT chips / Nicoletto, Gianni; Pirondi, Alessandro; Cova, Paolo. - (2000), pp. 973-976. (Intervento presentato al convegno SEM 9th International Congress on Experimental Mechanics tenutosi a Orlando, Folorida (USA) nel 5-8 giugno 2000).
Integrated approach for reliability assessment of press-pack IGBT chips
NICOLETTO, Gianni;PIRONDI, Alessandro;COVA, Paolo
2000-01-01
Abstract
Product development in the power electronic industry is characterized by short time-to-market and high reliability. Improved design methods and advanced modeling techniques are therefore required to support package design selection and to arrive at lifetime prediction algorithms for failure prevention. In this work experimental and computational activities aimed at supporting the development of a high-power press-pack IGBT are reported. A rig for accelerated testing of single IGBT chips under controlled contact pressure conditions is presented. Then, thermo-mechanical simulations of accelerated tests by the finite element method provided stress/strain evolution in the device and insight into the sources of local degradation.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
