In this paper a systematic approach is presented for extrapolating the lifetime due to bond wire lift-off in IGBT modules submitted to cyclic loading. Application profiles of the device are considered, as they are usually encountered in real current converters for railway traction systems. The proposed lifetime prediction scheme is based on the principle of the linear accumulation of the fatigue damage and takes into account the redundancy of the bond wires.
Lifetime extrapolation for IGBT modules under realistic operation conditions / M., Ciappa; Cova, Paolo; L., Cattani; F., Fantini; W., Fichtner. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 39:(1999), pp. 1131-1136. [10.1016/S0026-2714(99)00160-2]
Lifetime extrapolation for IGBT modules under realistic operation conditions
COVA, Paolo;
1999-01-01
Abstract
In this paper a systematic approach is presented for extrapolating the lifetime due to bond wire lift-off in IGBT modules submitted to cyclic loading. Application profiles of the device are considered, as they are usually encountered in real current converters for railway traction systems. The proposed lifetime prediction scheme is based on the principle of the linear accumulation of the fatigue damage and takes into account the redundancy of the bond wires.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
