Product development in the power electronic industry is characterized by the short time-tomarket and high-reliability requirements. Improved design methods and advanced modelling techniques are therefore required to support package design selection and to arrive at lifetime prediction algorithms for failure prevention. In this work, experimental and computational activities aimed at supporting the development of a press-pack insulated gate bipolar transistor (IGBT) is reported. A testing rig for accelerated testing of single IGBT chips under controlled contact pressure conditions is presented. Then, thermomechanical simulations of accelerated tests by the finite element method provided stress-strain evolution in the device and insight into the sources of local degradation.

Accelerated life testing and thermo-mechanical simulation in power electronic device development / Nicoletto, Gianni; Pirondi, Alessandro; Cova, Paolo. - In: JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN. - ISSN 0309-3247. - 34:(1999), pp. 455-462. [10.1016/S0038-1101(98)00229-9]

Accelerated life testing and thermo-mechanical simulation in power electronic device development

NICOLETTO, Gianni;PIRONDI, Alessandro;COVA, Paolo
1999-01-01

Abstract

Product development in the power electronic industry is characterized by the short time-tomarket and high-reliability requirements. Improved design methods and advanced modelling techniques are therefore required to support package design selection and to arrive at lifetime prediction algorithms for failure prevention. In this work, experimental and computational activities aimed at supporting the development of a press-pack insulated gate bipolar transistor (IGBT) is reported. A testing rig for accelerated testing of single IGBT chips under controlled contact pressure conditions is presented. Then, thermomechanical simulations of accelerated tests by the finite element method provided stress-strain evolution in the device and insight into the sources of local degradation.
Accelerated life testing and thermo-mechanical simulation in power electronic device development / Nicoletto, Gianni; Pirondi, Alessandro; Cova, Paolo. - In: JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN. - ISSN 0309-3247. - 34:(1999), pp. 455-462. [10.1016/S0038-1101(98)00229-9]
File in questo prodotto:
File Dimensione Formato  
reprint.pdf

non disponibili

Tipologia: Documento in Post-print
Licenza: NON PUBBLICO - Accesso privato/ristretto
Dimensione 425.51 kB
Formato Adobe PDF
425.51 kB Adobe PDF   Visualizza/Apri   Richiedi una copia

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11381/1642687
Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus 4
  • ???jsp.display-item.citation.isi??? 14
social impact