In this paper we report on experimental techniques for the thermal characterization of IGBT power modules. Three different systems have been used: the first one performs "in-time" characterization in order to control the most significant device parameters during normal operation or stress tests; the second one is for a complete and dynamic thermal characterization; finally, infrared optical analysis has been performed to validate the results.
Thermal characterization of IGBT power modules / Cova, Paolo; Ciappa, M; Franceschini, Giovanni; Malberti, P; Fantini, F.. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 37:(1997), pp. 1731-1734. [10.1016/S0026-2714(97)00150-9]
Thermal characterization of IGBT power modules
COVA, Paolo;FRANCESCHINI, Giovanni;
1997-01-01
Abstract
In this paper we report on experimental techniques for the thermal characterization of IGBT power modules. Three different systems have been used: the first one performs "in-time" characterization in order to control the most significant device parameters during normal operation or stress tests; the second one is for a complete and dynamic thermal characterization; finally, infrared optical analysis has been performed to validate the results.| File | Dimensione | Formato | |
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