Additional Microstructural Analysis on the Samples Examined in the Paper ‘Are High Resolution Resistometric Methods Really Useful for the Early Detection of Electromigration Damage?' / R., Balboni; DE MUNARI, Ilaria; M., Impronta; A., Scorzoni. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 39, No. 4:(1999), pp. 537-540. [10.1016/S0026-2714(99)00014-1]

Additional Microstructural Analysis on the Samples Examined in the Paper ‘Are High Resolution Resistometric Methods Really Useful for the Early Detection of Electromigration Damage?'

DE MUNARI, Ilaria;
1999-01-01

1999
Additional Microstructural Analysis on the Samples Examined in the Paper ‘Are High Resolution Resistometric Methods Really Useful for the Early Detection of Electromigration Damage?' / R., Balboni; DE MUNARI, Ilaria; M., Impronta; A., Scorzoni. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 39, No. 4:(1999), pp. 537-540. [10.1016/S0026-2714(99)00014-1]
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11381/1509281
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