This paper presents an experimental study of the main causes of scrap during the production of a woofer loudspeaker. After analyzing the most critical components of a transducer, samples with reference and modified components have been built and characterized in terms of frequency-response and linear distortion curves, and electrical, mechanical, acoustical parameters. In addition, a second set of samples has been built using reference components but varying the assembly process parameters; these samples also have been characterized as the previous ones. Measurements have been performed both in an anechoic chamber, along a production line and inside a car. By the analysis of acquired data, the authors have individuated the most influential components and assembly parameters in terms of required performance.

Woofer performance variance due to components and assembly process / Bellini, MARIA COSTANZA; Farina, Angelo. - ELETTRONICO. - (2018). (Intervento presentato al convegno 144th AES Convention tenutosi a Milano nel 2018 May 23–26).

Woofer performance variance due to components and assembly process

Maria Costanza Bellini
;
Angelo Farina
2018-01-01

Abstract

This paper presents an experimental study of the main causes of scrap during the production of a woofer loudspeaker. After analyzing the most critical components of a transducer, samples with reference and modified components have been built and characterized in terms of frequency-response and linear distortion curves, and electrical, mechanical, acoustical parameters. In addition, a second set of samples has been built using reference components but varying the assembly process parameters; these samples also have been characterized as the previous ones. Measurements have been performed both in an anechoic chamber, along a production line and inside a car. By the analysis of acquired data, the authors have individuated the most influential components and assembly parameters in terms of required performance.
2018
978-1-942220-24-4
Woofer performance variance due to components and assembly process / Bellini, MARIA COSTANZA; Farina, Angelo. - ELETTRONICO. - (2018). (Intervento presentato al convegno 144th AES Convention tenutosi a Milano nel 2018 May 23–26).
File in questo prodotto:
Non ci sono file associati a questo prodotto.

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11381/2847873
Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus ND
  • ???jsp.display-item.citation.isi??? ND
social impact