Advanced testing methods are necessary to develop reliable and marketable micromechanical system (MEMS); actually, due to the technological limits in the production process, the sensor's features are different from the design specifications. The aim of this paper is to present a low-cost technique able to find out how the structure responds to the actuation, at least in the main motion plane. Many different parameters are made available by this technique, not just the motion: it is possible to have the system's frequency response, the damping ratio and it can be a useful tool to verify the correct MEMS motion components. The measurement technique described in this paper is image-processing based: the image is grabbed by a camera placed on a microscope at a very low frame rate, increasing the shutter opening time, till a blurred but clear image is obtained (not lightening problems arise as often happens in high speed image processing). In this way aliasing is obviously present, but this fact is of no worry; actually a high cycles number is present in a single frame resulting in a blurred image: in this way the motion amplitude can be measured allowing to identify, in addition, the frequency response and the planar movement of the MEMS elements.

Mechanical testing of in-plane vibrations in memssensors, based on image processing technique / Cigada, A; Leo, E; Spinola, G; Vanali, Marcello. - ELETTRONICO. - (2006), pp. 1-9. (Intervento presentato al convegno 24th Conference and Exposition on Structural Dynamics 2006, IMAC-XXIV; St Louis, MI; United States; 30 January 2006 through 2 February 2006; Code 89649 tenutosi a S. Louis, Missouri, USA nel Gennaio, 2006).

Mechanical testing of in-plane vibrations in memssensors, based on image processing technique

VANALI, Marcello
2006-01-01

Abstract

Advanced testing methods are necessary to develop reliable and marketable micromechanical system (MEMS); actually, due to the technological limits in the production process, the sensor's features are different from the design specifications. The aim of this paper is to present a low-cost technique able to find out how the structure responds to the actuation, at least in the main motion plane. Many different parameters are made available by this technique, not just the motion: it is possible to have the system's frequency response, the damping ratio and it can be a useful tool to verify the correct MEMS motion components. The measurement technique described in this paper is image-processing based: the image is grabbed by a camera placed on a microscope at a very low frame rate, increasing the shutter opening time, till a blurred but clear image is obtained (not lightening problems arise as often happens in high speed image processing). In this way aliasing is obviously present, but this fact is of no worry; actually a high cycles number is present in a single frame resulting in a blurred image: in this way the motion amplitude can be measured allowing to identify, in addition, the frequency response and the planar movement of the MEMS elements.
2006
0912053941
978-091205394-3
Mechanical testing of in-plane vibrations in memssensors, based on image processing technique / Cigada, A; Leo, E; Spinola, G; Vanali, Marcello. - ELETTRONICO. - (2006), pp. 1-9. (Intervento presentato al convegno 24th Conference and Exposition on Structural Dynamics 2006, IMAC-XXIV; St Louis, MI; United States; 30 January 2006 through 2 February 2006; Code 89649 tenutosi a S. Louis, Missouri, USA nel Gennaio, 2006).
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11381/2545536
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